发明名称 METHOD FOR FORMING METAL INTERCONNECTION
摘要 PURPOSE: A method for forming a metal interconnection is provided to prevent an electron shading phenomenon and to improve the profile of the metal interconnection, by etching a metal layer for forming the metal interconnection by a pulse plasma etch method so that negative ions of the pulse plasma are actively generated. CONSTITUTION: The metal layer is formed on a lower structure(31). The metal layer is selectively etched to form a metal interconnection layer(32). The metal layer is selectively etched by a pulse plasma etch method using a frequency region where the density of negative ions and neutral radicals in the plasma increases.
申请公布号 KR20020021689(A) 申请公布日期 2002.03.22
申请号 KR20000054376 申请日期 2000.09.16
申请人 HYNIX SEMICONDUCTOR INC. 发明人 CHOI, CHANG JU
分类号 H01L21/3213;(IPC1-7):H01L21/321 主分类号 H01L21/3213
代理机构 代理人
主权项
地址