发明名称 MULTILAYER WIRING BOARD INCORPORATING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a multilayer wiring board incorporating an electronic part where the electronic part is mounted on the surface of an inside-layer conductor layer, with an area in which the electronic part is mounted entirely closed against outside, and an air-tight space is provided inside the closed area. SOLUTION: To protect an electronic part 30, especially an elastic surface- wave element which absorbs moisture and is sensitive to a noise, from moisture absorption, it is covered with a metal conductor layer 12 where the upper surface and the side surface of the inside surface of the area for mounting the electronic part 30 comprise a metal film. A metal film 22 is formed on a single lower-side surface or on both surfaces of an upper wiring board 20 to cap the housing part which is the inside of the area where the electronic part 30 is mounted. A metal conductor layer 12 of a metal film is provided on the inside-wall side-surface of a housing hole of an intermediate wiring plate 10 where the housing holes of various shapes are provided as the area in which the electronic part 30 is mounted.
申请公布号 JP2002084070(A) 申请公布日期 2002.03.22
申请号 JP20000272480 申请日期 2000.09.08
申请人 HITACHI AIC INC 发明人 SUGIURA RYOJI;SAKURAI MASAYUKI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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