发明名称 |
PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION, METHOD FOR PRODUCING PATTERN USING THE SAME, AND ELECTRONIC PARTS |
摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive polyimide precursor resin composition having high sensitivity and high resolution, a method for producing pattern using the composition, and electronic parts. SOLUTION: The photosensitive polyimide precursor composition contains (A) a polyimide precursor having repeating units of formula (I) (where R1 is a tetravalent organic group; R2 is a di-, tri- of tetravalent organic group; each R3 is a monovalent organic group of formula (II-1) or (II-2) (where X is an integer of 3-20; Y and R are each H or CH3; and Z is an integer of 2-10) or H, at least one R3 is such a monovalent organic group; A is a monovalent group exhibiting acidity; and (n) is 0, 1 or 2) and (B) a photopolymerization initiator. |
申请公布号 |
JP2002082436(A) |
申请公布日期 |
2002.03.22 |
申请号 |
JP20000300349 |
申请日期 |
2000.09.29 |
申请人 |
HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD |
发明人 |
OBATA RITSUKO;KINO RIKAKO;KAJI MAKOTO;KOBAYASHI AKIHIRO |
分类号 |
G03F7/038;C08F2/50;C08F290/14;C08F299/02;C08G73/12;G03F7/027;G03F7/028;H01L21/027 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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