| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealing method for electronic components wherein even when the resin sealing thickness is so small that it is ranged from the top surface of a wire to a depth not larger than 0.1 mm, the wire can be prevented from being exposed to the external, and the generating quantity of such an excess useless resin as not to contribute directly to the resin sealing can be reduced, and further, the method deals suitably with thinning packages. SOLUTION: In this method, a resin is filled and printed under a vacuum atmosphere in a heaping-full way only into the opening region portion of a stencil printing plate which includes a resin squeezing opening, and thereafter, it is subjected to a differential-pressure filling. Then, by the moving control for moving horizontally a secondary-printing squeegee, there is performed a finishing printing for scratching off the heaping-full resin from the top surface of the stencil printing plate. Still, the filling and printing in a heaping-full way of the resin is performed by the moving control for moving horizontally a primary-printing squeegee and elevating it single-handedly. It is preferred that the differential-pressure and finishing printings are also performed under vacuum atmospheres.
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