发明名称 METHOD OF MANUFACTURING LAMINATED CHIP COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a laminated chip component with which a clear display mark can be formed, laminate accuracy of green sheets can be improved and a laminated chip component in 3e quality can be obtained. SOLUTION: A step of temporarily pressing a plain green sheet lapped over an undercoat is repeated for a plurality of green sheets 11a, 11b, 11c. Subsequently, a step of temporarily pressing a green sheet, having an internal electrode pattern lapped over an undercoat is repeated for a plurality of green sheets 11d, 11e, 11f, 11g. A step of temporarily pressing a plain green sheet lapped over an undercoat is re-repeated for a plurality of green sheets 11h, 11i, 11j. A step is also included, where display marks 15, 18 are printed on a film 17 for display and pressed and transferred on the front surface of the laminated and temporarily-pressed green sheet laminates 11a-11i, and then the film 17 for display is peeled off.
申请公布号 JP2002083731(A) 申请公布日期 2002.03.22
申请号 JP20000271692 申请日期 2000.09.07
申请人 KOA CORP 发明人 ICHIKAWA MASABUMI;TAKAHASHI TAKESHI;MACHIDA KAZUMI
分类号 H01F41/04;(IPC1-7):H01F41/04 主分类号 H01F41/04
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