| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem of a prior art such the conventional measurement of electric characteristic of a semiconductor device uses a decision method which decides a non-defective unit in a rank required in a wafer step or other defective units, a large number of semiconductor elements are decided to be defective by the reason of the outside of the rank and cause deterioration of yield, loss in work and cost to unnecessary finished elements is large since non-defective units are decided again after assembling, and the finished elements which are unnecessary at present are stored as stocks and discarded. SOLUTION: When a process for measuring and deciding characteristic of a semiconductor element is performed, marking about the rank of result of decision is performed by determining a position of each rank, on a not operating region on the outer periphery of the semiconductor element. Only a semiconductor element which is requested can be selected and assembled by the position of the marking even if each of the semiconductor elements is isolated by dicing. Thereby loss in work and cost is reduced, and MPC yield can be remarkably improved.
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