| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed board for reduced variation in height of a conductive bump with no increase in the amount of bump plating. SOLUTION: A plated conductor 6 formed in a via hole 5 is so formed as to protrude above the surface of an insulating substrate 3, and the protruding part 7 is flattened under a press. Thus, the variation in plated height H is reduced. In a flattening process, pressing is performed with an elastic member 17 present between a ceramics surface plate 15 for sandwiching a printed board 1 and a press board 16. Thus, even with variation in the plated height H, the elastic member 17 absorbs the variation to keep the level of the press board 16. Thus, all the plated conductors 6 are applied with horizontal press, surely reducing variation in the plated height H. |
