| 摘要 |
PROBLEM TO BE SOLVED: To provide an organic copper complex having excellent thermal stability even on evaporation and suitable for the deposition of a copper thin film by a CVD process. SOLUTION: This organic copper complex is expressed by the following general formula (I) [wherein, R1 and R2 are a 1 to 8C alkyl group or a 1 to 8C perfluoroalkyl group; R3 is an H atom, an F atom or a 1 to 8C perfluoroalkyl group; at least one among R4 to R7 is a group expressed by -Ra-M-Rb (Ra is a 1 to 5C direct chain or branched alkylene group; Rb in the formula is a 1 to 5C direct chain or branched alkyl group or alkenyl group; M is an O atom or an S atom); and the balance is H or a 1 to 8C direct chain or branched alkyl group].
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