发明名称 FLEXIBLE PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a one-sided or double-sided flexible printed wiring board, which is modified in dimensional stability without marring the physical properties of the board, excellent in a migration resistance and suitable to a fine patterning. SOLUTION: A flexible printed wiring board is constituted using an electrically insulative film of a thickness of 10 to 30μm, a bonding agent of a thickness of 5 to 15μm, a copper foil of a thickness of 5 to 15μm and a board of a total thickness of 20 to 60μm.
申请公布号 JP2002084050(A) 申请公布日期 2002.03.22
申请号 JP20010192355 申请日期 2001.06.26
申请人 SHIN ETSU CHEM CO LTD 发明人 YUYAMA MASAHIRO;ARAI HITOSHI;EIKUCHI KICHIJI
分类号 B32B15/08;C09J109/02;C09J163/00;C09J201/00;H05K1/02;H05K1/03;H05K3/38;(IPC1-7):H05K1/03 主分类号 B32B15/08
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