发明名称 |
CONDUCTIVE MEMBER FOR FILLING UP THROUGH HOLE |
摘要 |
PROBLEM TO BE SOLVED: To provide a conductive member which fills up a through hole without causing wear nor generating voids and has good conductivity, and to provide a wiring board using the member. SOLUTION: This conductive member for filling up through hole is prepared by mixing (b) a metal having a low melting point of <=300 deg.C and (c) metal powder in (a) a substrate composed of a thermoplastic resin or thermoplastic elastomer, and their mixture.
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申请公布号 |
JP2002084052(A) |
申请公布日期 |
2002.03.22 |
申请号 |
JP20000272419 |
申请日期 |
2000.09.08 |
申请人 |
MITSUBISHI PLASTICS IND LTD |
发明人 |
HAYASHI TATSUYA |
分类号 |
H05K1/09;C08K3/08;C08L101/00;C08L101/08;H05K1/11;(IPC1-7):H05K1/11 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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