发明名称 CONDUCTIVE MEMBER FOR FILLING UP THROUGH HOLE
摘要 PROBLEM TO BE SOLVED: To provide a conductive member which fills up a through hole without causing wear nor generating voids and has good conductivity, and to provide a wiring board using the member. SOLUTION: This conductive member for filling up through hole is prepared by mixing (b) a metal having a low melting point of <=300 deg.C and (c) metal powder in (a) a substrate composed of a thermoplastic resin or thermoplastic elastomer, and their mixture.
申请公布号 JP2002084052(A) 申请公布日期 2002.03.22
申请号 JP20000272419 申请日期 2000.09.08
申请人 MITSUBISHI PLASTICS IND LTD 发明人 HAYASHI TATSUYA
分类号 H05K1/09;C08K3/08;C08L101/00;C08L101/08;H05K1/11;(IPC1-7):H05K1/11 主分类号 H05K1/09
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