| 摘要 |
PROBLEM TO BE SOLVED: To prevent occurrence of tomb stone, touching solder to electronic parts, positional deviations, etc., when solder is melted by reflow in a manufacturing process and a user process. SOLUTION: In a high frequency module provided with a substrate 1 carrying electronic parts 7a-7e soldered on the part mounting surface of the substrate 1 and a conductive cap which electromagnetically shields the substrate 1 and parts 7a-7e, insulating resins (insulating adhesives) 6a-6g are respectively applied to part of the surfaces of the substrate 1 in the spaces between the parts 7a-7e. |
