TRANSMISSION LINE CHIP AND ITS MANUFACTURING METHOD AND MULTICHIP MODULE

摘要

PROBLEM TO BE SOLVED: To provide a transmission line chip that reduces variation in the characteristic impendence between the transmission lines in a transmission line chip, by maintaining uniformity of the width and thickness of each transmission line and the pitch between lines, and to provide a method for manufacturing the transmission line chip. SOLUTION: The transmission line chip packaged between semiconductor chips laminates metal foil and a dielectric film and is manufactured by cutting to specific thickness, and alternately aligns the strip metal foil and dielectric film in each thickness direction. The aspect ratio is set to 1 or larger. In the transmission line chip, the matching of the characteristics impedance of the line is also satisfactory.