| 摘要 |
PROBLEM TO BE SOLVED: To overcome the problem of a prior art such that there is a BGA type semiconductor device packaged with semiconductor elements with a printed circuit board, a ceramic substrate and a flexible sheet or the like as supporting substrates but these supporting substrates are not originally required but are excessive materials, the semiconductor device is expanded by the thickness of the supporting substrates and the heat of semiconductor elements integrated inside is hardly dissipated. SOLUTION: Conductive patterns 11A-11D are formed while being embedded in an insulating resin 10 and further, conductive foil 20 is formed by half etching so that the thickness can be sufficiently formed thin. Besides, the electrode 11D for radiation is provided and thermally coupled with a second circuit pattern 19B of a mount substrate 18 and further, a radiating fin RD is adopted as a radiating means so that the semiconductor device, which improves radiation property, can be provided. |
