发明名称 Process of forming a pattern on a substrate
摘要 A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.
申请公布号 US2002034611(A1) 申请公布日期 2002.03.21
申请号 US20010978106 申请日期 2001.10.17
申请人 JSR CORPORATION, A JAPANESE CORPORATION 发明人 MASUKO HIDEAKI;UDAGAWA TADAHIKO;NEMOTO HIROAKI;BESSHO NOBUO
分类号 G03F7/00;H01L21/311;H05K1/09;H05K3/02;H05K3/06;H05K3/20;(IPC1-7):B32B5/16 主分类号 G03F7/00
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