发明名称 |
Process of forming a pattern on a substrate |
摘要 |
A process for forming an inorganic material layer pattern on a substrate. The process includes the steps of transferring an inorganic powder dispersed paste layer supported on a support film to the surface of the substrate to form the inorganic powder dispersed paste layer on the substrate; forming a resist film on the inorganic powder dispersed paste layer transferred to the surface of the substrate; exposing the resist film to light through a mask to form a latent image of a resist pattern; developing the exposed resist film to form the resist pattern; etching exposed portions of the inorganic powder dispersed paste layer to form an inorganic powder dispersed paste layer pattern corresponding to the resist pattern; and baking the pattern to form an inorganic material layer pattern.
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申请公布号 |
US2002034611(A1) |
申请公布日期 |
2002.03.21 |
申请号 |
US20010978106 |
申请日期 |
2001.10.17 |
申请人 |
JSR CORPORATION, A JAPANESE CORPORATION |
发明人 |
MASUKO HIDEAKI;UDAGAWA TADAHIKO;NEMOTO HIROAKI;BESSHO NOBUO |
分类号 |
G03F7/00;H01L21/311;H05K1/09;H05K3/02;H05K3/06;H05K3/20;(IPC1-7):B32B5/16 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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