| 发明名称 |
Process for etching silicon wafers |
| 摘要 |
The present invention relates to an aqueous etching solution, a method for tailoring the composition of the solution to provide a desired surface quality for a given quantity of stock to be removed, a process for etching a silicon wafer using said solution.
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| 申请公布号 |
US2002034881(A1) |
申请公布日期 |
2002.03.21 |
| 申请号 |
US20010896945 |
申请日期 |
2001.06.29 |
| 申请人 |
KULKARNI MILIND S.;ERK HENRY F.;SCHMIDT JUDITH |
发明人 |
KULKARNI MILIND S.;ERK HENRY F.;SCHMIDT JUDITH |
| 分类号 |
C30B29/06;C09K13/08;C30B33/10;H01L21/306;(IPC1-7):H01L21/302 |
主分类号 |
C30B29/06 |
| 代理机构 |
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