发明名称 Method of forming polycrystalline semiconductor film
摘要 It is possible to prevent lowering in productivity of thin-film transistors with no decrease in performance of the transistors. Provided are depositing an amorphous semiconductor film on a substrate, a first irradiating the amorphous semiconductor film with an energy-rich beam in an atmosphere of a gas containing an inert gas as a major component with a specific amount of oxygen, to change the amorphous semiconductor film into a polycrystalline semiconductor film, and a second irradiating the polycrystalline semiconductor film with an energy-rich beam in an atmosphere of a gas containing an inert gas as major component with oxygen of an amount less than the specific amount.
申请公布号 US2002034845(A1) 申请公布日期 2002.03.21
申请号 US20010954152 申请日期 2001.09.18
申请人 FUJIMURA TAKASHI;KAWAMURA SHINICHI 发明人 FUJIMURA TAKASHI;KAWAMURA SHINICHI
分类号 G02F1/1368;H01L21/20;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/786;(IPC1-7):H01L21/00 主分类号 G02F1/1368
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