发明名称 Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry
摘要 A cerium oxide slurry for polishing comprising cerium oxide dispersed in water, wherein the slurry has a conductivity of about 30c muS/cm or less when the cerium oxide concentration in the slurry is c wt.%. In order to adjust the conductivity to about 30c muS/cm or less, cerium oxide is washed with deionized water.
申请公布号 US2002032989(A1) 申请公布日期 2002.03.21
申请号 US20010968846 申请日期 2001.10.03
申请人 SHOWA DENKO K.K. 发明人 KIDO TAKANORI;SANBAYASHI MASAYUKI;TSUJINO FUMIO;ICHIKAWA KAGETAKA
分类号 B24B37/00;C09C1/68;C09G1/02;C09K3/14;H01L21/304;H01L21/306;(IPC1-7):C09C1/68 主分类号 B24B37/00
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