| 摘要 |
<p>An alignment apparatus wherein a correction for centering semiconductor wafers (5A, 5B) is determined from four wafer edges sensed by non-contact position sensors (21-24) to center the semiconductor wafers (5A, 5B) in a wafer delivery position P1 where the semiconductor wafers (5A, 5B) are delivered from a wafer transfer robot (4) to a wafer transfer apparatus (14).</p> |
