制造供一电气组件封套用之一种基座之方法与装置以及供一电器组件封套用之一种基座,申请号TW019684-传众专利搜索

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发明名称	制造供一电气组件封套用之一种基座之方法与装置以及供一电器组件封套用之一种基座
摘要
申请公布号	TW012292	申请公布日期	1973.03.01
申请号	TW019684	申请日期	1971.12.18
申请人	飞利浦电泡厂	发明人	CERARDUS CORNELIS MARIE BENSCH;HENDRINKUS JOHANNES CHRISTIANU;SIMON JONKER
分类号	H01B	主分类号	H01B
代理机构		代理人	陈长文台北巿敦化北路二○一号七楼
主权项
地址	荷兰爱尔荷芬巿以马内利街29号

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