| 摘要 |
<heading lvl="0">Abstract of Disclosure</heading> An apparatus and method for covering a landfill includes a deployer suspended below the bucket of a loader. A roll of film is disposed on the deployer and uncoiled to deploy a film covering on the landfill surface as the loader driven across the surface. Periodically, the bucket, containing a ballast material, is manipulated, allowing ballast material to be disposed on the film to hold the deployed film in place. In a preferred embodiment, the deployer includes a mandrel mounted between two flanges for supporting a roll of film. The deployer is preferably attached to the bucket by chains or wire rope in such a manner so as to allow full operation of bucket while the deployer is attached.
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