| 摘要 |
<p>The present invention provides a method of forming a pattern on an insulating substrate, the method comprising the steps of: providing an insulating substrate (10) made of organic polymer; and treating the substrate (10) with a laser beam so as to irradiate selective portions (20) of the substrate in accordance with the pattern to be formed. Upon laser treatment, the irradiated portions (20) of the substrate (10) undergo a modification, for example undergo ablation and/or become conductive due to carbonization and/or graphitization of the substrate material. The method of the invention may be used in the manufacture of printed circuit boards. In such cases, the laser treated substrate is further exposed to an electroless metal plating step and/or to a galvanic deposition step for the selective deposition of metal (30) on the irradiated areas (20).</p> |
