| 摘要 |
A contactless interconnecting system is provided between a computer chip package and a circuit board. The chip package has a substantially planar lower surface with a pattern of discrete terminal lands. The circuit board has a substantially planar upper surface spaced from and generally parallel to the lower surface of the chip package. A pattern of discrete circuit pads on the upper surface are aligned with the terminal lands. A plurality of discrete interposer members are disposed between the terminal lands and the circuit pads and are in a pattern corresponding to and aligned with the aligned patterns of the terminal lands and circuit pads. The interposer members are preferably of a material having a higher dielectric constant that of the material filling the gaps between interposer members. |
