发明名称 |
Printed circuit board, method of making same, and photomask for use in the method |
摘要 |
A printed circuit board comprises a base substrate including a conductive circuit pattern on a top surface thereof, and at least one photosensitive resin layer positioned on the base substrate. The resin layer exposure is performed through a photomask having light-shielding and exposure amount adjusting portions as part thereof to accommodate for varying resin layer thicknesses.
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申请公布号 |
US2002034619(A1) |
申请公布日期 |
2002.03.21 |
申请号 |
US20010953322 |
申请日期 |
2001.09.14 |
申请人 |
YAMADA SHINJI;TSUKADA YUTAKA |
发明人 |
YAMADA SHINJI;TSUKADA YUTAKA |
分类号 |
H05K3/46;B32B3/02;B32B27/34;B32B27/38;H05K3/00;(IPC1-7):B32B3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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