发明名称 |
Holding unit for semiconductor wafer sawing |
摘要 |
A holding unit is provided to support an ingot in a semiconductor wafer sawing machine, which minimizes the instability of a blade during a sawing process. The holding unit is formed from substantially the same material as an ingot resting thereon. The holding unit includes a top surface for receiving an ingot, a bottom surface, a pair of side walls, and a cavity formed in the holding unit. The cavity forms a plurality of break points in the holding unit. When contacted by the blade, the holding unit fractures at the break points to minimize the chipping of the wafer.
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申请公布号 |
US2002033171(A1) |
申请公布日期 |
2002.03.21 |
申请号 |
US20010999641 |
申请日期 |
2001.10.23 |
申请人 |
MCGREGOR A. DEMPSEY;TOOMBS MARSHALL P.;BROOKS JAMES E.;MEADOWS BENJAMIN J. |
发明人 |
MCGREGOR A. DEMPSEY;TOOMBS MARSHALL P.;BROOKS JAMES E.;MEADOWS BENJAMIN J. |
分类号 |
B28D5/00;(IPC1-7):B28D1/02 |
主分类号 |
B28D5/00 |
代理机构 |
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代理人 |
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地址 |
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