CMP SYSTEM FOR METAL DEPOSITION

摘要

A system for dished metal redevelopment by providing a metal deposition solution at an interface between a moving semiconductor wafer (1) and a moving polishing pad, which deposits metal onto dished metal (5) in trenches (4) in a layer (3) of an interlayer dielectric; and by polishing the wafer (1) with a relatively reduced polishing pressure to polish metal being deposited. A polishing fluid is disclosed for use in a CMP polishing system, the polishing fluid being a metal deposition solution for dished metal redevelopment.