发明名称 Process control method e.g. for semiconductor disc or wafer manufacture has readiness point for each successive process sequence step provided in dependence on start point of preceding step
摘要 The process control method has a readiness point for each successive step in a process sequence provided in dependence on the start time for the preceding process sequence step, so that the end time of the preceding step coincides with the start time of the following step. The readiness command for the following step is provided upon reaching a given time point after the start of the preceding step. An Independent claim for a process control device is also included.
申请公布号 DE10123805(A1) 申请公布日期 2002.03.21
申请号 DE20011023805 申请日期 2001.05.16
申请人 MITSUBISHI DENKI K.K., TOKIO/TOKYO;RYODEN SEMICONDUCTOR SYSTEM ENGINEERING CORP., ITAMI 发明人 OKABE, MASATAKA;OHTSUKA, HIROFUMI;YANARU, TAICHI
分类号 H01L21/02;G05B15/02;H01L21/00;(IPC1-7):G05B15/02;G05B19/02 主分类号 H01L21/02
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