METHOD AND SYSTEM FOR EFFICIENTLY COMPUTING A NUMBER OF INTEGRATED CIRCUIT DIES

摘要

A method and system thereof for efficiently computing the number of dies per wafer and the corresponding number of stepper shots. Dimensions for a die and the size of the wafer are received. The dimensions comprise a die element size that is a function of a scribe lane width, a guard ring width, an input/output pad area, and a length and a width of the die. A die count lookup table is selected for the specified wafer size and used to determine the die count corresponding to the die element size. In a similar manner, a stepper shot count lookup table is selected for the specified wafer size and used to determine the stepper shot count corresponding to the die element size. Because the die element size accounts for the different production parameters, a die count lookup table and a stepper shot count lookup table need to exist only for each wafer size, significantly reducing the number of required lookup tables and correspondingly reducing the amount of storage space and maintenance required.