发明名称 |
THICK FILM MILLIMETER WAVE TRANSCEIVER MODULE |
摘要 |
A thick film millimeter wave transceiver module includes a base plate and a multi-layer substrate board having a plurality of layers of low temperature transfer tape received on the base plate. The different layers can vary. They can include a DC signals layer having signal tracks in connection; a ground layer having ground connections; a device layer having capacitors and resistors embedded therein; and a top layer having cut-outs for receiving MMIC chips therein. A solder preform layer is located between the device layer and the top layer for securing any MMIC chips. A channelization plate is received over the multi-layer substrate board and a channel is formed to receive MMIC chips and provide isolation between transmit and receive signals. |
申请公布号 |
WO0223674(A2) |
申请公布日期 |
2002.03.21 |
申请号 |
WO2001US26965 |
申请日期 |
2001.08.29 |
申请人 |
XYTRANS, INC. |
发明人 |
AMMAR, DAN, F. |
分类号 |
H05K3/46;H01L21/60;H01L23/043;H01L23/32;H01L23/34;H01L23/538;H01L23/66;H01L25/16;H01L27/12;H01L29/40;H01Q21/00;H04B1/18;H04B1/38;H05K1/02;H05K1/03;H05K1/16;H05K3/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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