| 摘要 |
A semiconductor device (11) includes a semiconductor chip (25) housed, with its active surface facing upward, in a through hole (24) of a printed circuit board (23) provided with an interconnection pattern (22) on its top surface. Electrode terminals (25E) of the active surface are connected to the interconnection pattern (22) by bonding wires (26). A sealing resin layer (27) seals the bonding wires (26) and semiconductor chip (25) together and fixes the semiconductor chip (25) in the through hole (24). The bottom surface of the printed circuit board (23), the downward facing back surface of the semiconductor chip (25), and the bottom surface of the sealing resin layer (27) are finished to the same flat surface by grinding and polishing. This reduces and simultaneously achieves a uniform mounting height, does not require complicated steps for mounting individual chips (25), improves the manufacturing yield, achieves a uniform height of the semiconductor device (11) without being affected by the variation in thickness of the chips (25), and enables execution of electrical tests all together. <IMAGE> |
