发明名称 Molding die apparatus, method for molding disc substrate, and disc-shaped recording medium
摘要 <p>In order to prevent a molded disc substrate (2) from generating a separation pattern, a molding die (1) includes a stationary die (6) and a movable die (7), and an outer circumference ring (16) for molding an outer circumference end of the disc substrate (2). The outer circumference ring (16) is so mounted as to be movable along forward and backward directions in parallel with a moving direction of the movable die (7) toward the stationary die (6), and has a retaining surface (39) for retaining the outer circumference of the molded disc substrate (2). <IMAGE></p>
申请公布号 EP1188536(A2) 申请公布日期 2002.03.20
申请号 EP20010307759 申请日期 2001.09.12
申请人 SONY CORPORATION 发明人 FUKUSHIMA, YOSHIHITO
分类号 B29C45/26;G11B7/26;(IPC1-7):B29C45/26;B29L19/00 主分类号 B29C45/26
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