Process and apparatus for flow soldering

摘要

There is provided a flow soldering process for mounting an electronic component onto a board (13) by means of a lead-free solder material, wherein the molten solder material is supplied and attached to a predetermined portion of the board (13) in a solder material supplying zone (6), and thereafter the board (13) is cooled by a cooling unit in a cooling zone (7) such that the solder material adhering to the board (13) is rapidly cooled to solidify.