STRUCTURE OF CHIP SIZE SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A structure of a chip size semiconductor package is provided to make a semiconductor package have a volume similar to a semiconductor chip by using adhesive having conductivity in only Z axis and a flexible circuit board. CONSTITUTION: A plurality of input/output pads(4) are formed on the semiconductor chip. Adhesive(6) is attached to one surface of the semiconductor chip having the plurality of input/output pads, having non-conductivity in X and Y axes and conductivity in only a Z axis. The flexible circuit board(10) is attached to the upper surface of the adhesive having conductivity only in a Z axis. A connecting pad(14) is formed in a position under flexible tape(12) corresponding to the input/output pads of the semiconductor chip. A copper trace(16) is connected to the connecting pad. A plurality of solder ball lands(18) are formed in an end of the copper trace, penetrating the flexible tape. A plurality of solder balls(20) are melted and attached to the solder ball lands of the flexible circuit board.