发明名称 METHOD FOR IMPROVING MODULUS OF ELASTICITY OF BIODEGRADABLE RESIN
摘要 PURPOSE: To provide a method for simply and easily improving the modules of elasticity of a biodegradable resin, in order to apply the resin as a casing, etc., of electronic equipment because most of electrical appliances are discarded as incombustible refuses when disposal and then the use of a biodegradable resin is proposed, but inferior in heat resistance. CONSTITUTION: For example, a molded product of polylactic acid is subjected to aging at a temperature not lower than the glass transition temperature of the polyactic acid +15°C and humidifying conditions of >= 60% relative humidity. Thereby, the modulus of elasticity can be improved to, e.g. 107 Pa to 109 Pa in a short time. The molded product without causing the deformation even in aging tests, e.g. at 80°C and 80 RH% for 100 h can be obtained by improving the modulus of elasticity.
申请公布号 KR20020021322(A) 申请公布日期 2002.03.20
申请号 KR20010053720 申请日期 2001.09.01
申请人 SONY CORPORATION 发明人 FUJIHIRA YUKO;MORI HIROYUKI;NOGUCHI TSUTOMU
分类号 C08J3/00;B29B13/02;B29C45/00;B29C45/72;B29C71/02;C08J7/00;C08K5/29;C08L67/04;C08L101/16;(IPC1-7):C08J3/00 主分类号 C08J3/00
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