Convertible cooling module for air or water cooling of electronic circuit components

摘要

The cooling module includes a base plate, a number of thermally conductive plates affixed to the base plate and arranged parallel to each other, for defining fluid flow path. A circuit module carrier is coupled to an opposite side of the base plate to form a sealed enclosure with the base plate an a thermally conductive contact with cups of circuit modules within the enclosure. The module also incorporates a flow path dividing plate disposed perpendicular to the plates so as to define at least two distinctive floe paths through the conductive plates. A set of two shrouds is includes, e.g. one of the shrouds is for directing the fluid flow in one direction in one of the paths.