| 发明名称 |
Pad conditioner cleaning apparatus |
| 摘要 |
A chemical mechanical polishing apparatus includes a pad conditioner having a conditioner head, a cleaning cup for receiving and cleaning the conditioner head of the pad conditioner, and a fluid dispenser for dispensing a cleaning fluid onto the conditioner head.
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| 申请公布号 |
US6358124(B1) |
申请公布日期 |
2002.03.19 |
| 申请号 |
US19980222180 |
申请日期 |
1998.12.29 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
KOGA RAIJIRO;TSURUTA HIROMI;KUMAGAI TAKASHI;HOEY GEE;BROWN BRIAN J.;FISHKIN BORIS;REDEKER FRED C.;LU BRUCE;LU REX;WANG K. Y.;SHU ROLAND |
| 分类号 |
B24B37/04;B24B53/00;H01L21/00;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
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代理人 |
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| 主权项 |
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