RESIN COMPOSITION FOR SEALING

摘要

PROBLEM TO BE SOLVED: To obtain an electrical insulation material capable of increasing a content of heat-conductive filler and having high thermal conductivity without impairing mixability and moldability by combining a large filler having an edge part with a fine filler. SOLUTION: This resin composition for sealing is characterized in that a thermosetting resin or a thermoplastic resin is compounded with >=60 wt.% of a first inorganic filler having an edge part and >=35μm particle diameter and <=10 wt.% of a second inorganic filler from which an edge part is removed and which has <=4μm particle diameter.