| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors which reduces the staining of molds and has excellent mold release characteristics and water-vapor resistance. SOLUTION: The epoxy resin composition for sealing semiconductors comprises (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler, and (E) a glycerol fatty acid triester of glycerol with a 24-36C saturated fatty acid as the essential components.
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