| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for optical semiconductor sealing use excellent in transparency, fluidity and soldering resistance, and to provide an optical semiconductor device sealed with the composition. SOLUTION: The epoxy resin composition for optical semiconductor sealing use is characterized by essentially comprising an epoxy resin of a specific structure, a curing agent, a curing promoter and a transparent inorganic filler. The optical semiconductor device is such one as to be sealed with this composition.
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