| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for interposers, having high soldering resistance owing to its excellent high heat resistance, low thermal expansion and low water absorption, and to provide prepregs and copper-clad laminates each using the composition. SOLUTION: The epoxy resin composition for interposers is characterized by essentially comprising (A) an epoxy resin having at least three epoxy groups in one molecule, (B) a brominated epoxy resin, (C) a phenolic resin-based curing agent having at least three phenolic hydroxy groups in one molecule and (D) spherical fused silica.
|
