发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device includes a MOS-type field effect transistor (SOI-MOSFET) formed on a thin silicon layer on an insulator layer. The SOI-MOSFET has a gate overlap-type LDD structure in which additional source/drain regions having an impurity concentration of 3x1017 to 3x1018/cm3 overlapping with a gate electrode are provided in the silicon layer. According to this structure, when the SOI-MOSFET is on operation, only the additional source/drain regions are depleted, so that it is possible to obtain satisfactory transistor characteristics. Additional source/drain regions in this structure are formed by combination of vertical ion implantation using the gate electrode as a mask and thermal diffusion or oblique ion implantation using the gate electrode as a mask.
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申请公布号 |
US6358783(B1) |
申请公布日期 |
2002.03.19 |
申请号 |
US19990233212 |
申请日期 |
1999.01.20 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
YAMAGUCHI YASUO;NISHIMURA TADASHI |
分类号 |
H01L27/12;H01L21/02;H01L21/265;H01L21/336;H01L29/78;H01L29/786;(IPC1-7):H01L21/00 |
主分类号 |
H01L27/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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