发明名称 |
Multichip module having a stacked chip arrangement |
摘要 |
A multichip module has at least two semiconductor chips wherein each has a row of bonding pads formed on the active surface thereof and disposed along one side edge thereof. In some embodiments, the semiconductor chips may have a plurality of bonding pads along only two mutually perpendicular side edges thereof. The semiconductor chips are mounted to a substrate in a stacking arrangement wherein the upper chip is attached to the active surface of the lower chip in a manner that no portion of the upper chip interferes with a vertical line of sight of each bonding pad of the lower chip to permit wire bonding thereof. Therefore, all semiconductor chips can be wire bonded simultaneously after stacking the chips on the substrate. This allows wire bonding of all chips to be completed in a single step so as to increase UPH (unit per hour), thereby reducing cost for manufacturing the MCM.
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申请公布号 |
US6359340(B1) |
申请公布日期 |
2002.03.19 |
申请号 |
US20000628676 |
申请日期 |
2000.07.28 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
LIN CHUN HUNG;CHEN KUANG-HUI;WANG SHYH-WEI;TAO SU;CHEN JIAN WEN |
分类号 |
H01L25/065;(IPC1-7):H05K7/06 |
主分类号 |
H01L25/065 |
代理机构 |
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主权项 |
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地址 |
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