发明名称 Method for superior step coverage and interface control for high K dielectric capacitors and related electrodes
摘要 The present invention provides a multi-layer semiconductor memory device comprising: a bottom electrode having a bottom layer, an upper interface layer and an intermediate tuning layer disposed between the bottom layer and the upper interface layer; a top electrode; and a high dielectric constant dielectric layer disposed between the bottom electrode and the top electrode. The present invention further provides an apparatus and a method for manufacturing high density DRAMs having capacitors having high quality HDC materials and low leakage currents. Another aspect of the present invention provides an electrode-dielectric interface that nucleates high quality HDC films. The present invention further provides an apparatus and a method for manufacturing capacitors within a high aspect ratio aperture.
申请公布号 US6358810(B1) 申请公布日期 2002.03.19
申请号 US19980123690 申请日期 1998.07.28
申请人 APPLIED MATERIALS, INC. 发明人 DORNFEST CHARLES;EGERMEIER JOHN;KHURANA NITIN
分类号 H01L27/04;H01L21/02;H01L21/316;H01L21/822;H01L21/8242;H01L27/108;(IPC1-7):H01L21/20 主分类号 H01L27/04
代理机构 代理人
主权项
地址