发明名称 Epoxy resin composition and semiconductor device using the same
摘要 There is provided a resin composition having high flame retardancy, which improves high temperature storage of an epoxy resin composition comprising an epoxy resin having biphenyl structure without a halogenated flame retardant and an antimony compound as a conventional flame retardant. High temperature storage was improved, a glass transition temperature (Tg) became not less than 150° C. and V-0 class in flame retardance standard (UL94) was accomplished by employing (1) an epoxy resin having biphenyl structure mainly as an epoxy resin, (2) a phenolic aralkyl resin mainly as a curing agent, (3) 0.5 to 30 parts by weight of a polyimide resin as an additive based on total 100 parts by weight of the epoxy resin and the curing agent, (4) a polysiloxane compound modified with polyether containing an amino group as a flame retardant, (5) not less than 87% by weight of a fused silica as an inorganic filler based on the total composition.
申请公布号 US6358629(B1) 申请公布日期 2002.03.19
申请号 US20000713010 申请日期 2000.11.16
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 AGA FUMIAKI
分类号 C08L63/00;H01L23/29;(IPC1-7):H01L29/12 主分类号 C08L63/00
代理机构 代理人
主权项
地址