LAPPING AND POLISHING METHOD AND APPARATUS FOR PLANARIZING PHOTORESIST AND METAL MICROSTRUCTURE LAYERS

摘要

A method and apparatus for planarizing photoresist and/or metal microstructu re layers is provided. Planarization is achieved by removing material from a workpiece (64) by lapping using a diamond containing lapping slurry (58). A lapping machine is furnished with a lapping plate (50) made of a soft metal material. The lapping plate (50) is furnished with ridges of controlled heig ht using a diamond conditioning ring (62) with a specified grit size. Free diamonds in a liquid slurry (58) are then sprayed onto the plate (50) and embedded therein by a second conditioning ring. After the lapping plate (50) is conditioned, the piece to be lapped (64) is mounted on the lapping plate (50). A vacuum hold fixture or flat steel or glass mounting plate may be use d. During lapping, additional diamond slurry (58) is sprayed onto the lapping plate (50) and driven into the plate by a ceramic conditioning ring (62).