| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in curability under moisture absorption, fluidity and reflow crack resistance, and to provide electronic part devices mounted with elements sealed with the composition. SOLUTION: This epoxy resin composition essentially comprises (A) an epoxy resin, (B) a phenolic resin and (C) an addition reaction product from a quinone compound and a phosphine compound with at least one alkyl group bound to the phosphorus atom. The molded product obtained from the composition has a glass transition temperature of <155 deg.C. The electronic part devices mounted with elements sealed with the composition are also provided.
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