| 摘要 |
An integrated cleaner with scrubber for cleaning and scrubbing semiconductor substrates that includes a housing that contains both a cleaning module and a scrubbing module. The cleaning module is capable of performing a wet-cleaning process on a batch of the semiconductor substrates. The cleaning module comprises a cleaning tank in which a batch of semiconductor substrates are cleaned. A megasonic device can be attached to the cleaning tank to enhance cleaning. The scrubbing module includes a plurality of scrubbers each of which scrubs a semiconductor substrate. The integrated cleaner with scrubber also comprises a robot for moving the semiconductor substrates between the cleaning and scrubbing modules. The inventive machine and process allows the cleaning and scrubbing of semiconductor substrates without removal from the housing while maintaining as static the surface chemistry of the semiconductor substrates, as well as the ambient humidity, the ambient temperature, and the ambient particle contamination within the housing. A drying module may also be included and made integral with in the housing to dry the semiconductor substrates.
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