发明名称 Polishing liquid supply apparatus
摘要 A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.
申请公布号 US6358125(B2) 申请公布日期 2002.03.19
申请号 US20000724999 申请日期 2000.11.29
申请人 EBARA CORPORATION 发明人 KAWASHIMA KIYOTAKA;TANIKAWA MUTSUMI;SHIMOMOTO HIROSHI;CHONO KEIKO
分类号 B01F3/08;B24B37/00;B24B37/04;B24B57/02;H01L21/304;(IPC1-7):B24B7/19 主分类号 B01F3/08
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