| 摘要 |
A printed-wiring substrate including a substrate 101 having pin-bonding portions 111 formed on a main surface 104 thereof and lead pins 121. The lead pins 121 each have a flange 123 and a shaft portion 122 and being brazed to corresponding pin-bonding portions 111 via the corresponding flanges 123. A hemispherical convex shape is imparted to a bonding surface 124 of a flange 123. The flange 123 is used for brazing of a lead pin 121, and the bonding surface 124 faces a pin-bonding portion 111 of a substrate 101. A brazing filler metal 131 used for brazing of the lead pin 121 extends by wetting toward the tip end of the lead pin 121 beyond the outermost edge 127 of an opposite surface 126 of the flange 123, which is opposite the bonding surface 124 of the flange 123, such that an extension-by-wetting end of the brazing filler metal 131 is located between the outermost edge 127 and a shaft portion 122 of the lead pin 121. Since the solder 131 has no narrow portion, the bonding strength is not impaired. |
