发明名称 |
CHIP TYPE LIGHT EMITTING DIODE AND METHOD OF MANUFACTURE THE SAME |
摘要 |
PURPOSE: A chip type light emitting diode and method of manufacture the same are provided to be mounted together with other electronic components on a mother board in the same process at one time and to be very useful as a light source for a liquid crystal backlight. CONSTITUTION: The chip type light emitting diode has a base portion mounted to one surface side of the mother board, a body portion extending from the base portion and adapted to pass through a hole in the mother board, and a light emitting portion provided on the body portion to emit light on the other surface side of the mother board. The base portion is provided with a pair of external connection electrodes electrically connected to the light emitting portion. The light emitting portion is sealed with a resin sealant block. The method of manufacturing a chip type light emitting diode performs a plurality of steps to form a plurality of chip type light emitting diodes on a single collective circuit board and a final step of dividing the collective circuit board into individual chip type light emitting diodes. |
申请公布号 |
KR20020021004(A) |
申请公布日期 |
2002.03.18 |
申请号 |
KR20010053816 |
申请日期 |
2001.09.03 |
申请人 |
CITIZEN ELECTRONICS CO., LTD. |
发明人 |
FUKASAWA KOICHI |
分类号 |
H01L23/28;G02B6/42;H01L33/54;H01L33/56;H01L33/60;H05K1/18;(IPC1-7):H01L33/00 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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