| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mechanism for mounting a tape carrier inexpensively with a high reliability. SOLUTION: In electrical connection of the mounting structure between a tape carrier and a circuit substrate 3, a solder 11 is previously coated onto an outer lead 2 of the tape carrier, and then the tape carrier and circuit substrate are subjected to a thermocompressing process. Since the solder coat of the outer lead after the thermocompression has a central recess, the quality of the soldering can be confirmed easily and reliably.</p> |
